2005 03 204-210
溅射沉积技术的发展及其现状
基金项目(Foundation):
国家自然科学基金(No.30400109)
邮箱(Email):
DOI:
10.13922/j.cnki.cjovst.2005.03.012
中文作者单位:
西南交通大学材料学院生物材料及表面工程研究所,西南交通大学材料学院生物材料及表面工程研究所,西南交通大学材料学院生物材料及表面工程研究所,西南交通大学材料学院生物材料及表面工程研究所,西南交通大学材料学院生物材料及表面工程研究所 成都610031中国工程物理研究院机械制造工艺研究所绵阳621900 ,成都610031 ,成都610031 ,成都610031 ,成都610031教授,博导
摘要(Abstract):
论述了溅射沉积薄膜技术的发展历程及其目前的研究应用状况。二极溅射应用于薄膜制备,揭开了溅射沉积技术的序幕,磁控溅射促使溅射沉积技术进入实质的工业化应用,并通过控制磁控靶磁场的分布方式和增加磁控靶数量,进一步发展为非平衡磁控溅射、多靶闭合式非平衡磁控溅射等,拓宽了应用范围。射频、脉冲电源尤其是脉冲电源在溅射技术中的使用极大地延伸了溅射沉积技术的应用范围。
关键词(KeyWords):
溅射沉积;;磁控溅射;;非平衡磁控溅射;;脉冲溅射
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参考文献
1 汪泓宠,田民波.离子束表面强化.北京:机械工业出版社,1992
2 KellyPJ,ArnellRD.Magnetronsputtering:areviewofrecent developmentandapplications.Vacuum,2000,56:156～172
3 SchneiderJM,SproulWD,MatthewsA.Phaseformationand mechanicalpropertiesofaluminacoatingspreparedatsubstrate temperatureslessthan500℃byionizedandconventionalsput tering.SurfCoatTechnol,1997,9495:179～183
4 GuruvenketS,RaoGM.Biasinducedstructuralchangesin tungstennitridefilmsdepositedbyunbalancedmagnetronsput tering.MaterSciEng,2004,106(2B):172～176
5 ZhuJ,HanJ,MengSetal.Correlationsbetweensubstratebias,microstructureandsurfacemorphologyoftetrahedralamorphous carbonfilms.Vacuum,2004,72(3):285～290
6 TakahashiT,MasugataK,KawaiHetal.Surfacemorphologyof TiNfilmsreactivelydepositedbybiassputtering.Vacuum,2000,59(23):777～784
7 DurusoyHZafer,Duyar zlem,AydiliAtillaetal.Influenceof substratetemperatureandbiasvoltageontheopticaltransmit tanceofTiNfilms.Vacuum,2003,70(12):21～28
8 WindowB,SavvidesN.Chargedparticlefluxesfromplanarmag netronsputteringsources.JVacSciTechnol,1986,4(2A):196～202
9 WindowB,SavvidesN.Unbalanceddcmagnetronsassourcesof highionfluxes.JVacSciTechnol,1986,4(2A):453～456
10 SavvidesN,WindowB.Unbalancedmagnetronion assistedde positionandpropertymodificationofthinfilms.JVacSciTech nol,1986,4(2A):504～508
11 SproulWD,RudnikPJ,MichaelEGrabametal.Highrate reactivesputteringinanopposedcathodeclosed fieldunbal ancedmagnetronsputteringsystem.SurfCoatTechnol,1990,4344:270～278
12 FloresM,MuhlS,AndradeE.Therelationbetweentheplasma characteristicandthecorrosionpropertiesofTiN/Timultilayers depositedbyunbalancedmagnetronsputtering.ThinSolid Films,2003,433:217～223
13 KomathM,RaoGM,MohanS.Studiedontheoptimizationof unbalancedmagnetronsputteringcathodes.Vacuum,1999,52(3):307～311
14 MusilJ,Matou J,ValvodaV.Effectofionbombardmentonthe surfacemorphologyofZn filmssputteredinanunbalanced magnetron.Vacuum,1995,46(2):203～210
15 Ku elRJr,ValvodeV,Chl dekMetal.XRDmicrostructural studyofZnfilmsdepositedbyunbalancedmagnetronsputter ing.ThinSolidFilms,1995,263:150～158
16 YooJ,AhnS,KimJetal.Influenceoftargetpowerdensity andsubstratebiasvoltageontheelectrochemicalproperties type304SSfilmspreparedbyunbalancedmagnetronsputter ing.SurfCoatTechnol,2002,157:47～54
17 HampshireJ,KellyPJ,TeerDG.Thestructureofco deposited aluminium titaniumalloycoatings.ThinSolidFilms,2004,447448:418～424
18 BatesRI,ArnellRD.Microstructureofnovelcorrosion resis tantcoatingsforsteelcomponentsbyunbalancedmagnetron sputtering.SurfCoatTechnol,1997,89:204～212
19 TanJN,HsiehJH.Depositionandcharacterizationof(Nb,Cr)Nthinfilmsbyunbalancedmagnetronsputtering.SurfCoat Technol,2003,167:154～160
20 LiuC,FairhurstRG,RenLetal.Co depositionoftitanium/polytetrafluoroethylenefilmsbyunbalancedmagnetronsputter ing.SurfCoatTechnol,2002,149:143～150
21 HsiehJH,LiC,WuWetal.SynthesisofTi(C,N,O)coat ingsbyunbalancedmagnetronsputtering.JMaterProcTech nol,2003,140:662～667
22 HsiehJH,WuW,LiCetal.Depositionandcharacterization ofTi(C,N,O)coatingsbyunbalancedmagnetronsputtering.SurfCoatTechnol,2003,163164:233～237
23 RenevierNM,FoxVC,TeerDGetal.Coatingcharacteristicsandtribologicalpropertiesofsputter depositedMoS2/metal compositecoatingsdepositedbyclosedfieldunbalancedmag netronsputterionplating.SurfCoatTechnol,2000,127:24～37
24 RigatoV,MaggioniG,PatelliAetal.Propertiesofsputter de positedMoS2/metalcompositecoatingsdepositedbyclosed fieldunbalancedmagnetronsputterionplating.SurfCoatTech nol,2000,131:206～210
25 徐禄祥,刘艳文,周红芳等.不同晶体结构氧化钛薄膜性能研究.功能材料,2004,39(增刊):2461～2463
26 徐禄祥,冷永祥,黄 楠.磁控溅射工艺参数对氧化钛薄膜晶体结构的影响.功能材料,2004,39(增刊):3143～3146
27 许 生,候晓波,范垂祯等.硅靶中频反应磁控溅射二氧化硅薄膜的特性研究.真空,2001,(5):1～6
28 SproulWD.High ratereactiveDCmagnetronsputteringofox ideandnitridesuperlatticecoatings.Vacuum,1998,51(4):641～646
29 KellyPJ,BeeversCF,HendersonPSetal.Acomparisonof thepropertiesoftitanium basedfilmsproducedbypulsedand continuousDCmagnetronsputtering.SurfCoatTechnol,2003,174175:795～800
30 SchillerS,GoedickeK,ReschkeJetal.Pulsedmagnetron sputtertechnology.SurfCoatTechnol,1993,61:331～337
31 CremerR,WitthautM,Neusch櫣tzDetal.Comparativecharac terizationofaluminacoatingsdepositedbyRF,DCandpulsed reactivemagnetronsputtering.SurfCoatTechnol,1999,120121:213～218
32 MiyagiT,KameiM,OgawaTetal.Pulsemodeeffectsoncrys tallizationtemperatureoftitaniumdioxidefilmsinpulsemag netronsputtering.ThinSolidFilms,2003,442:32～35
33 BartzschH,Gl cβD,B cherBetal.PropertiesofSiO2and Al2O3filmsforelectricalinsulationapplicationsdepositedby reactivepulsemagnetronsputtering.SurfCoatTechnol,2003,174175:774～778
34 XuLX,LengYX,ZhouHFetal.Structureandhemocompat ibilityoftitaniumoxidefilmssynthesizedbycontinuousor pulsedDCmagnetronsputtering.KeyEngineeringMaterials,2005,288-289:299～302
35 TreichelO,KirchhoffV.Theinfluenceofpulsedmagnetron sputteringontopographyandcrystallinityofTiO2filmson glass.SurfCoatTechnol,2000,123:268～272
36 L blP,HuppertzM,MergelD.NucleationandgrowthinTiO2filmspreparedbysputteringandevaporation.ThinSolidFilms,1994,251:72～79
2 KellyPJ,ArnellRD.Magnetronsputtering:areviewofrecent developmentandapplications.Vacuum,2000,56:156～172
3 SchneiderJM,SproulWD,MatthewsA.Phaseformationand mechanicalpropertiesofaluminacoatingspreparedatsubstrate temperatureslessthan500℃byionizedandconventionalsput tering.SurfCoatTechnol,1997,9495:179～183
4 GuruvenketS,RaoGM.Biasinducedstructuralchangesin tungstennitridefilmsdepositedbyunbalancedmagnetronsput tering.MaterSciEng,2004,106(2B):172～176
5 ZhuJ,HanJ,MengSetal.Correlationsbetweensubstratebias,microstructureandsurfacemorphologyoftetrahedralamorphous carbonfilms.Vacuum,2004,72(3):285～290
6 TakahashiT,MasugataK,KawaiHetal.Surfacemorphologyof TiNfilmsreactivelydepositedbybiassputtering.Vacuum,2000,59(23):777～784
7 DurusoyHZafer,Duyar zlem,AydiliAtillaetal.Influenceof substratetemperatureandbiasvoltageontheopticaltransmit tanceofTiNfilms.Vacuum,2003,70(12):21～28
8 WindowB,SavvidesN.Chargedparticlefluxesfromplanarmag netronsputteringsources.JVacSciTechnol,1986,4(2A):196～202
9 WindowB,SavvidesN.Unbalanceddcmagnetronsassourcesof highionfluxes.JVacSciTechnol,1986,4(2A):453～456
10 SavvidesN,WindowB.Unbalancedmagnetronion assistedde positionandpropertymodificationofthinfilms.JVacSciTech nol,1986,4(2A):504～508
11 SproulWD,RudnikPJ,MichaelEGrabametal.Highrate reactivesputteringinanopposedcathodeclosed fieldunbal ancedmagnetronsputteringsystem.SurfCoatTechnol,1990,4344:270～278
12 FloresM,MuhlS,AndradeE.Therelationbetweentheplasma characteristicandthecorrosionpropertiesofTiN/Timultilayers depositedbyunbalancedmagnetronsputtering.ThinSolid Films,2003,433:217～223
13 KomathM,RaoGM,MohanS.Studiedontheoptimizationof unbalancedmagnetronsputteringcathodes.Vacuum,1999,52(3):307～311
14 MusilJ,Matou J,ValvodaV.Effectofionbombardmentonthe surfacemorphologyofZn filmssputteredinanunbalanced magnetron.Vacuum,1995,46(2):203～210
15 Ku elRJr,ValvodeV,Chl dekMetal.XRDmicrostructural studyofZnfilmsdepositedbyunbalancedmagnetronsputter ing.ThinSolidFilms,1995,263:150～158
16 YooJ,AhnS,KimJetal.Influenceoftargetpowerdensity andsubstratebiasvoltageontheelectrochemicalproperties type304SSfilmspreparedbyunbalancedmagnetronsputter ing.SurfCoatTechnol,2002,157:47～54
17 HampshireJ,KellyPJ,TeerDG.Thestructureofco deposited aluminium titaniumalloycoatings.ThinSolidFilms,2004,447448:418～424
18 BatesRI,ArnellRD.Microstructureofnovelcorrosion resis tantcoatingsforsteelcomponentsbyunbalancedmagnetron sputtering.SurfCoatTechnol,1997,89:204～212
19 TanJN,HsiehJH.Depositionandcharacterizationof(Nb,Cr)Nthinfilmsbyunbalancedmagnetronsputtering.SurfCoat Technol,2003,167:154～160
20 LiuC,FairhurstRG,RenLetal.Co depositionoftitanium/polytetrafluoroethylenefilmsbyunbalancedmagnetronsputter ing.SurfCoatTechnol,2002,149:143～150
21 HsiehJH,LiC,WuWetal.SynthesisofTi(C,N,O)coat ingsbyunbalancedmagnetronsputtering.JMaterProcTech nol,2003,140:662～667
22 HsiehJH,WuW,LiCetal.Depositionandcharacterization ofTi(C,N,O)coatingsbyunbalancedmagnetronsputtering.SurfCoatTechnol,2003,163164:233～237
23 RenevierNM,FoxVC,TeerDGetal.Coatingcharacteristicsandtribologicalpropertiesofsputter depositedMoS2/metal compositecoatingsdepositedbyclosedfieldunbalancedmag netronsputterionplating.SurfCoatTechnol,2000,127:24～37
24 RigatoV,MaggioniG,PatelliAetal.Propertiesofsputter de positedMoS2/metalcompositecoatingsdepositedbyclosed fieldunbalancedmagnetronsputterionplating.SurfCoatTech nol,2000,131:206～210
25 徐禄祥,刘艳文,周红芳等.不同晶体结构氧化钛薄膜性能研究.功能材料,2004,39(增刊):2461～2463
26 徐禄祥,冷永祥,黄 楠.磁控溅射工艺参数对氧化钛薄膜晶体结构的影响.功能材料,2004,39(增刊):3143～3146
27 许 生,候晓波,范垂祯等.硅靶中频反应磁控溅射二氧化硅薄膜的特性研究.真空,2001,(5):1～6
28 SproulWD.High ratereactiveDCmagnetronsputteringofox ideandnitridesuperlatticecoatings.Vacuum,1998,51(4):641～646
29 KellyPJ,BeeversCF,HendersonPSetal.Acomparisonof thepropertiesoftitanium basedfilmsproducedbypulsedand continuousDCmagnetronsputtering.SurfCoatTechnol,2003,174175:795～800
30 SchillerS,GoedickeK,ReschkeJetal.Pulsedmagnetron sputtertechnology.SurfCoatTechnol,1993,61:331～337
31 CremerR,WitthautM,Neusch櫣tzDetal.Comparativecharac terizationofaluminacoatingsdepositedbyRF,DCandpulsed reactivemagnetronsputtering.SurfCoatTechnol,1999,120121:213～218
32 MiyagiT,KameiM,OgawaTetal.Pulsemodeeffectsoncrys tallizationtemperatureoftitaniumdioxidefilmsinpulsemag netronsputtering.ThinSolidFilms,2003,442:32～35
33 BartzschH,Gl cβD,B cherBetal.PropertiesofSiO2and Al2O3filmsforelectricalinsulationapplicationsdepositedby reactivepulsemagnetronsputtering.SurfCoatTechnol,2003,174175:774～778
34 XuLX,LengYX,ZhouHFetal.Structureandhemocompat ibilityoftitaniumoxidefilmssynthesizedbycontinuousor pulsedDCmagnetronsputtering.KeyEngineeringMaterials,2005,288-289:299～302
35 TreichelO,KirchhoffV.Theinfluenceofpulsedmagnetron sputteringontopographyandcrystallinityofTiO2filmson glass.SurfCoatTechnol,2000,123:268～272
36 L blP,HuppertzM,MergelD.NucleationandgrowthinTiO2filmspreparedbysputteringandevaporation.ThinSolidFilms,1994,251:72～79
基本信息:
DOI：10.13922/j.cnki.cjovst.2005.03.012
中图分类号:TB43
引用信息:
[1]杨文茂,刘艳文,徐禄祥,冷永祥,黄楠.溅射沉积技术的发展及其现状[J].真空科学与技术学报,2005(03):204-210.DOI:10.13922/j.cnki.cjovst.2005.03.012.
基金信息:
国家自然科学基金(No.30400109)